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Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw

Electrochemical multi-wire sawing (EMWS) is a hybrid machining method based on a traditional multi-wire sawing (MWS) system. In this new method, a silicon ingot is connected to a positive electrode; the slicing wire is connected to a negative electrode. Material is removed by the interaction of mech...

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Autores principales: Bao, Guanpei, Huang, Chen, Zhang, Yajing, Yu, Zhen, Wang, Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9505672/
https://www.ncbi.nlm.nih.gov/pubmed/36144092
http://dx.doi.org/10.3390/mi13091469
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author Bao, Guanpei
Huang, Chen
Zhang, Yajing
Yu, Zhen
Wang, Wei
author_facet Bao, Guanpei
Huang, Chen
Zhang, Yajing
Yu, Zhen
Wang, Wei
author_sort Bao, Guanpei
collection PubMed
description Electrochemical multi-wire sawing (EMWS) is a hybrid machining method based on a traditional multi-wire sawing (MWS) system. In this new method, a silicon ingot is connected to a positive electrode; the slicing wire is connected to a negative electrode. Material is removed by the interaction of mechanical grinding and an electrochemical reaction. In this paper, contrast experiments of EMWS and MWS were conducted based on industrialized equipment to verify the beneficial effects of the hybrid method. The experimental statistical results show that the composite processing method improved the processing qualification rate by 1.28%, and the Bow of silicon wafers was reduced by about 2.74 microns. Further testing on the surface of the silicon wafer after electrochemical action showed that obvious holes were present on the surface, and the surface hardness of the wafer decreased significantly. Therefore, the scratches on the surface of wafer sliced by EMWS were reduced; in addition, the thickness of the surface damage layer was reduced by about 9 microns. After standard texturing, the average reflectivity of the wafers sliced by EMWS was about 2–10% lower than that of the wafers sliced by MWS in the wavelength of 300–1100 nm. In this paper, the voltage parameter of the composite machining is set to 48 V; the amount of electrolyte added in each experiment is 2 L; and a good machining effect is obtained. In the future, the electric parameters and cutting fluid components will be further studied to improve the electrochemical effect.
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spelling pubmed-95056722022-09-24 Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw Bao, Guanpei Huang, Chen Zhang, Yajing Yu, Zhen Wang, Wei Micromachines (Basel) Article Electrochemical multi-wire sawing (EMWS) is a hybrid machining method based on a traditional multi-wire sawing (MWS) system. In this new method, a silicon ingot is connected to a positive electrode; the slicing wire is connected to a negative electrode. Material is removed by the interaction of mechanical grinding and an electrochemical reaction. In this paper, contrast experiments of EMWS and MWS were conducted based on industrialized equipment to verify the beneficial effects of the hybrid method. The experimental statistical results show that the composite processing method improved the processing qualification rate by 1.28%, and the Bow of silicon wafers was reduced by about 2.74 microns. Further testing on the surface of the silicon wafer after electrochemical action showed that obvious holes were present on the surface, and the surface hardness of the wafer decreased significantly. Therefore, the scratches on the surface of wafer sliced by EMWS were reduced; in addition, the thickness of the surface damage layer was reduced by about 9 microns. After standard texturing, the average reflectivity of the wafers sliced by EMWS was about 2–10% lower than that of the wafers sliced by MWS in the wavelength of 300–1100 nm. In this paper, the voltage parameter of the composite machining is set to 48 V; the amount of electrolyte added in each experiment is 2 L; and a good machining effect is obtained. In the future, the electric parameters and cutting fluid components will be further studied to improve the electrochemical effect. MDPI 2022-09-04 /pmc/articles/PMC9505672/ /pubmed/36144092 http://dx.doi.org/10.3390/mi13091469 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Bao, Guanpei
Huang, Chen
Zhang, Yajing
Yu, Zhen
Wang, Wei
Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw
title Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw
title_full Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw
title_fullStr Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw
title_full_unstemmed Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw
title_short Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw
title_sort experimental study on surface integrity of solar cell silicon wafers sliced by electrochemical multi-wire saw
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9505672/
https://www.ncbi.nlm.nih.gov/pubmed/36144092
http://dx.doi.org/10.3390/mi13091469
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