Cargando…
Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw
Electrochemical multi-wire sawing (EMWS) is a hybrid machining method based on a traditional multi-wire sawing (MWS) system. In this new method, a silicon ingot is connected to a positive electrode; the slicing wire is connected to a negative electrode. Material is removed by the interaction of mech...
Autores principales: | Bao, Guanpei, Huang, Chen, Zhang, Yajing, Yu, Zhen, Wang, Wei |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9505672/ https://www.ncbi.nlm.nih.gov/pubmed/36144092 http://dx.doi.org/10.3390/mi13091469 |
Ejemplares similares
-
Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface
por: Liang, Lie, et al.
Publicado: (2023) -
Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing
por: Liu, Tengyun, et al.
Publicado: (2022) -
The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw
por: Liu, Tengyun, et al.
Publicado: (2021) -
Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon
por: Li, Ansheng, et al.
Publicado: (2023) -
Grain flash temperatures in diamond wire sawing of silicon
por: Pala, Uygar, et al.
Publicado: (2021)