Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

With speeding up development of 5 G chips, high-efficient thermal structure and precise management of tremendous heat becomes a substantial challenge to the power-hungry electronics. Here, we demonstrate an interpenetrating architecture of electrocaloric polymer with highly thermally conductive path...

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Detalles Bibliográficos
Autores principales: Li, Ming-Ding, Shen, Xiao-Quan, Chen, Xin, Gan, Jia-Ming, Wang, Fang, Li, Jian, Wang, Xiao-Liang, Shen, Qun-Dong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9532434/
https://www.ncbi.nlm.nih.gov/pubmed/36195612
http://dx.doi.org/10.1038/s41467-022-33596-z

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9532434/
https://www.ncbi.nlm.nih.gov/pubmed/36195612
http://dx.doi.org/10.1038/s41467-022-33596-z

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