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Cathode diffusion layer and current collector with slotted foam stainless steel for a micro direct methanol fuel cell

In order to reduce the contact and mass transfer impedance of the diffusion layer and current collector of a Micro Direct Methanol Fuel Cell (μDMFC), a novel Membrane Electrode Assembly (MEA) structure is designed by using Foam Stainless Steel (FSS) with a slotting rate of 38.47% for both the cathod...

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Detalles Bibliográficos
Autores principales: Zhao, Zhengang, Wang, Ziten, Li, Kang, Zhang, Dacheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9549570/
https://www.ncbi.nlm.nih.gov/pubmed/36320517
http://dx.doi.org/10.1039/d2ra04891d
Descripción
Sumario:In order to reduce the contact and mass transfer impedance of the diffusion layer and current collector of a Micro Direct Methanol Fuel Cell (μDMFC), a novel Membrane Electrode Assembly (MEA) structure is designed by using Foam Stainless Steel (FSS) with a slotting rate of 38.47% for both the cathode diffusion layer and the current collector. Electrochemical tests are performed on the Foam Stainless Steel Membrane Electrode Assembly (FSS-MEA) and the Conventional Carbon Paper Membrane Electrode Assembly (CCP-MEA) μDMFCs. The experimental results show that the maximum power density of FSS-MEA μDMFC is 46.55 mW cm(−2) at 343 K, which is 42.88% higher than that of CCP-MEA μDMFC, and the optimum working concentration of FSS-MEA μDMFC is 2.5 mol L(−1), which is 1 mol L(−1) higher than that of CCP-MEA μDMFC. Electrochemical Impedance Spectroscopy (EIS) test results show that the contact impedance of FSS-MEA μDMFC is 0.55 Ω cm(−2), which is 15.38% lower than that of CCP-MEA μDMFC. The mass transfer impedance of FSS-MEA μDMFC is 0.99 Ω cm(−2), which is 25.56% lower than that of CCP-MEA μDMFC. This implies that the novel slotted FSS-MEA structure alleviates the methanol crossover and reduces the contact and mass transfer impedance, thus improving μDMFC power density.