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Fabrication of Cu@Sn TLPS joint for high temperature power electronics application

In this study, a novel Cu@Sn TLPS joint was fabricated for high-temperature power electronics application. Cu@Sn core–shell composite powder was firstly prepared by a methylate electroplating method, and then pressed into a preformed sheet. The Cu@Sn preform was reflowed at 250 ∼ 280 °C for 40 min u...

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Detalles Bibliográficos
Autores principales: Zhang, Honghui, Xu, Hongyan, Liu, Xuan, Xu, Ju
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9554939/
https://www.ncbi.nlm.nih.gov/pubmed/36320725
http://dx.doi.org/10.1039/d2ra04606g