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Fabrication of Cu@Sn TLPS joint for high temperature power electronics application
In this study, a novel Cu@Sn TLPS joint was fabricated for high-temperature power electronics application. Cu@Sn core–shell composite powder was firstly prepared by a methylate electroplating method, and then pressed into a preformed sheet. The Cu@Sn preform was reflowed at 250 ∼ 280 °C for 40 min u...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
The Royal Society of Chemistry
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9554939/ https://www.ncbi.nlm.nih.gov/pubmed/36320725 http://dx.doi.org/10.1039/d2ra04606g |