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Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
Three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been used to integrate passive devices, and optoelectronic devices due to its superior electrical qualities, outstanding mechanical stability, and lower cost. Nevertheless, the performance and reliability of the...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9607209/ https://www.ncbi.nlm.nih.gov/pubmed/36296152 http://dx.doi.org/10.3390/mi13101799 |