Cargando…

Liquid Oxygen Compatibility and Ultra-Low-Temperature Mechanical Properties of Modified epoxy Resin Containing Phosphorus and Nitrogen

Endowing epoxy resin (EP) with prospective liquid oxygen compatibility (LOC) as well as enhanced ultra-low-temperature mechanical properties is urgently required in order to broaden its applications in aerospace engineering. In this study, a reactive phosphorus/nitrogen-containing aromatic ethylened...

Descripción completa

Detalles Bibliográficos
Autores principales: Liu, Ni, Wang, Hui, Wang, Shun, Xu, Baosheng, Qu, Lijie
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9610556/
https://www.ncbi.nlm.nih.gov/pubmed/36297922
http://dx.doi.org/10.3390/polym14204343
Descripción
Sumario:Endowing epoxy resin (EP) with prospective liquid oxygen compatibility (LOC) as well as enhanced ultra-low-temperature mechanical properties is urgently required in order to broaden its applications in aerospace engineering. In this study, a reactive phosphorus/nitrogen-containing aromatic ethylenediamine (BSEA) was introduced as a reactive component to enhance the LOC and ultra-low-temperature mechanical properties of an EP/biscitraconimide resin (BCI) system. The resultant EP thermosets showed no sensitivity reactions in the 98J liquid oxygen impact test (LOT) when the BSEA content reached 4 wt% or 5 wt%, indicating that they were compatible with liquid oxygen. Moreover, the bending properties, fracture toughness and impact strength of BSEA-modified EP were greatly enhanced at RT and cryogenic temperatures (77 K) at an appropriate level of BSEA content. The bending strength (251.64 MPa) increased by 113.67%, the fracture toughness (2.97 MPa·m(1/2)) increased by 81.10%, and the impact strength (31.85 kJ·m(−2)) increased by 128.81% compared with that of pure EP at 77 K. All the above results demonstrate that the BSEA exhibits broad application potential in liquid oxygen tanks and in the cryogenic field.