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Thermal Conductance of Copper–Graphene Interface: A Molecular Simulation
Copper is often used as a heat-dissipating material due to its high thermal conductivity. In order to improve its heat dissipation performance, one of the feasible methods is to compound copper with appropriate reinforcing phases. With excellent thermal properties, graphene has become an ideal reinf...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9654340/ https://www.ncbi.nlm.nih.gov/pubmed/36363179 http://dx.doi.org/10.3390/ma15217588 |