Thin-Copper-Layer-Induced Early Fracture in Graphene-Nanosheets (GNSs)-Reinforced Copper-Matrix-Laminated Composites

The strength–ductility trade-off has been a long-standing challenge when designing and fabricating a novel metal matrix composite. In this study, graphene-nanosheets (GNSs)-reinforced copper (Cu)-matrix-laminated composites were fabricated through two methods, i.e., the alternating electrodeposition technique followed by spark plasma sintering (SPS) and direct electrodeposition followed by hot-press sintering. As a result, a Cu-GNS-Cu layered structure formed in the composites with various Cu layer thicknesses. Compared with the pure Cu, the yield strength of the GNS/Cu composites increased. However, the mechanical performance of the GNS/Cu composites was strongly Cu-layer-thickness-dependent, and the GNS/Cu composite possessed a brittle fracture mode when the Cu layer was thin ([Formula: see text] 10 μm). The fracture mechanism of the GNS/Cu composites was thoroughly investigated and the results showed that the premature failure of the GNS/Cu composites with a thin Cu layer may be due to the lack of Cu matrix, which can relax the excessive stress intensity triggered by GNSs and delay the crack connection between neighboring GNS layers. This study highlights the soft Cu matrix in balancing the strength and ductility of the GNS/Cu-laminated composites and provides new technical and theoretical support for the preparation and optimization of other laminated metal matrix composites.