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Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

Cu-to-Cu direct bonding plays an important role in three-dimensional integrated circuits (3D IC). However, the bonding process always requires high temperature, high pressure, and a high degree of consistency in height. In this study, Sn is passivated over electroplated copper. Because Sn is a soft...

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Detalles Bibliográficos
Autores principales:	Kung, Po-Yu, Huang, Wei-Lun, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Kao, C. R.
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9657724/ https://www.ncbi.nlm.nih.gov/pubmed/36363374 http://dx.doi.org/10.3390/ma15217783

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