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Effect of Temperature on the Complex Modulus of Mg-Based Unidirectionally Aligned Carbon Fiber Composites

Composite materials based on magnesium–lithium (MgLi) and magnesium–yttrium (MgY) matrices reinforced with unidirectional carbon fibers were prepared using the gas pressure infiltration method. Two types of carbon fibers were used, high-strength PAN-based T300 fibers and high-modulus pitch-based Gra...

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Detalles Bibliográficos
Autores principales: Kúdela, Stanislav, Koráb, Juraj, Štefánik, Pavol
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9658449/
https://www.ncbi.nlm.nih.gov/pubmed/36363407
http://dx.doi.org/10.3390/ma15217812
Descripción
Sumario:Composite materials based on magnesium–lithium (MgLi) and magnesium–yttrium (MgY) matrices reinforced with unidirectional carbon fibers were prepared using the gas pressure infiltration method. Two types of carbon fibers were used, high-strength PAN-based T300 fibers and high-modulus pitch-based Granoc fibers. The PAN-based carbon fibers have an internal turbostratic structure composed of crystallites. The pitch-based carbon fibers have a longitudinally aligned graphite crystal structure. The internal carbon fiber structure is crucial in the context of the interfacial reaction with the alloying element. There are various mechanisms of bonding to carbon fibers in the case of magnesium–lithium and magnesium–yttrium alloys. This paper presents the use of the DMA method for the characterization of the role of alloying elements in the quality of interfacial bonding and the influence on the complex modulus at increasingly elevated temperatures (50–250 °C). The complex modulus values of the composites with T300 fibers were in the range of 118–136 GPa. The complex modulus values of the composites with Granoc fibers were in the range of 198–236 GPa. The damping capacity of magnesium-based unidirectionally aligned carbon fiber composites is related to the quality of the interfacial bonding.