Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging

This study demonstrates room-temperature bonding using a getter layer for the vacuum packaging of microsystems. A thick Ti layer covered with an Au layer is utilized as a getter layer because it can absorb gas molecules in the package. Additionally, smooth Au surfaces can form direct bonds for herme...

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Detalles Bibliográficos
Autores principales: Matsumae, Takashi, Kariya, Shingo, Kurashima, Yuichi, Thu, Le Hac Huong, Higurashi, Eiji, Hayase, Masanori, Takagi, Hideki
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9658547/
https://www.ncbi.nlm.nih.gov/pubmed/36365842
http://dx.doi.org/10.3390/s22218144

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