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Significantly Enhanced Electromagnetic Interference Shielding Performances of Epoxy Nanocomposites with Long-Range Aligned Lamellar Structures
High‑efficiency electromagnetic interference (EMI) shielding materials are of great importance for electronic equipment reliability, information security and human health. In this work, bidirectional aligned Ti(3)C(2)T(x)@Fe(3)O(4)/CNF aerogels (BTFCA) were firstly assembled by bidirectional freezin...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Springer Nature Singapore
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9666581/ https://www.ncbi.nlm.nih.gov/pubmed/36378424 http://dx.doi.org/10.1007/s40820-022-00949-8 |
Sumario: | High‑efficiency electromagnetic interference (EMI) shielding materials are of great importance for electronic equipment reliability, information security and human health. In this work, bidirectional aligned Ti(3)C(2)T(x)@Fe(3)O(4)/CNF aerogels (BTFCA) were firstly assembled by bidirectional freezing and freeze-drying technique, and the BTFCA/epoxy nanocomposites with long-range aligned lamellar structures were then prepared by vacuum-assisted impregnation of epoxy resins. Benefitting from the successful construction of bidirectional aligned three-dimensional conductive networks and electromagnetic synergistic effect, when the mass fraction of Ti(3)C(2)T(x) and Fe(3)O(4) are 2.96 and 1.48 wt%, BTFCA/epoxy nanocomposites show outstanding EMI shielding effectiveness of 79 dB, about 10 times of that of blended Ti(3)C(2)T(x)@Fe(3)O(4)/epoxy (8 dB) nanocomposites with the same loadings of Ti(3)C(2)T(x) and Fe(3)O(4). Meantime, the corresponding BTFCA/epoxy nanocomposites also present excellent thermal stability (T(heat-resistance index) of 198.7 °C) and mechanical properties (storage modulus of 9902.1 MPa, Young's modulus of 4.51 GPa and hardness of 0.34 GPa). Our fabricated BTFCA/epoxy nanocomposites would greatly expand the applications of MXene and epoxy resins in the fields of information security, aerospace and weapon manufacturing, etc. [Image: see text] SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s40820-022-00949-8. |
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