A unified approach and descriptor for the thermal expansion of two-dimensional transition metal dichalcogenide monolayers

Two-dimensional (2D) materials have enabled promising applications in modern miniaturized devices. However, device operation may lead to substantial temperature rise and thermal stress, resulting in device failure. To address such thermal challenges, the thermal expansion coefficient (TEC) needs to...

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Detalles Bibliográficos
Autores principales: Zhong, Yang, Zhang, Lenan, Park, Ji-Hoon, Cruz, Samuel, Li, Long, Guo, Liang, Kong, Jing, Wang, Evelyn N.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2022
Materias:
Physical and Materials Sciences
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9674296/
https://www.ncbi.nlm.nih.gov/pubmed/36399559
http://dx.doi.org/10.1126/sciadv.abo3783

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9674296/
https://www.ncbi.nlm.nih.gov/pubmed/36399559
http://dx.doi.org/10.1126/sciadv.abo3783

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