Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing

Monocrystalline silicon is an important material for processing electronic and photovoltaic devices. The fixed diamond wire sawing technology is the first key technology for monocrystalline silicon wafer processing. A systematic study of the relationship between the fracture strength, stress and bre...

Descripción completa

Detalles Bibliográficos
Autores principales: Liu, Tengyun, Su, Yancai, Ge, Peiqi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9692905/
https://www.ncbi.nlm.nih.gov/pubmed/36363919
http://dx.doi.org/10.3390/mi13111895

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9692905/
https://www.ncbi.nlm.nih.gov/pubmed/36363919
http://dx.doi.org/10.3390/mi13111895

Ejemplares similares