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A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope

A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main body and low-resistance silicon column as the vertic...

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Detalles Bibliográficos
Autores principales:	Jia, Lu, Han, Guowei, Wei, Zhenyu, Si, Chaowei, Ning, Jin, Yang, Fuhua, Han, Weihua
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9693977/ https://www.ncbi.nlm.nih.gov/pubmed/36422395 http://dx.doi.org/10.3390/mi13111967

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