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High-Speed Dicing of SiC Wafers with 0.048 mm Diamond Blades via Rolling-Slitting
In this study, an innovative fabrication method called rolling-slitting forming, which forms ultra-thin diamond blades, was presented for the first time. Furthermore, the feasibility of the rolling-slitting forming method when applied to silicon carbide wafer dicing blades was investigated; moreover...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9694500/ https://www.ncbi.nlm.nih.gov/pubmed/36431565 http://dx.doi.org/10.3390/ma15228083 |