Magnetic Interconnects Based on Composite Multiferroics

The development of magnetic logic devices dictates a need for a novel type of interconnect for magnetic signal transmission. Fast signal damping is one of the problems which drastically differs from conventional electric technology. Here, we describe a magnetic interconnect based on a composite multiferroic comprising piezoelectric and magnetostrictive materials. Internal signal amplification is the main reason for using multiferroic material, where a portion of energy can be transferred from electric to magnetic domains via stress-mediated coupling. The utilization of composite multiferroics consisting of piezoelectric and magnetostrictive materials offers flexibility for the separate adjustment of electric and magnetic characteristics. The structure of the proposed interconnect resembles a parallel plate capacitor filled with a piezoelectric, where one of the plates comprises a magnetoelastic material. An electric field applied across the plates of the capacitor produces stress, which, in turn, affects the magnetic properties of the magnetostrictive material. The charging of the capacitor from one edge results in the charge diffusion accompanied by the magnetization change in the magnetostrictive layer. This enables the amplitude of the magnetic signal to remain constant during the propagation. The operation of the proposed interconnects is illustrated by numerical modeling. The model is based on the Landau–Lifshitz–Gilbert equation with the electric field-dependent anisotropy term included. A variety of magnetic logic devices and architectures can benefit from the proposed interconnects, as they provide reliable and low-energy-consuming data transmission. According to the estimates, the group velocity of magnetic signals may be up to 10(5) m/s with energy dissipation less than 10(−18) J per bit per 100 nm. The physical limits and practical challenges of the proposed approach are also discussed.