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Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring

This paper was concerned with the current level of progress towards the development of chipless radio frequency identification (RFID) sensors that are capable of sensing strain and temperature. More specifically, it was interested in the possibility that the resulting devices could be used as a pass...

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Detalles Bibliográficos
Autores principales: Mc Gee, Kevin, Anandarajah, Prince, Collins, David
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695512/
https://www.ncbi.nlm.nih.gov/pubmed/36433277
http://dx.doi.org/10.3390/s22228681
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author Mc Gee, Kevin
Anandarajah, Prince
Collins, David
author_facet Mc Gee, Kevin
Anandarajah, Prince
Collins, David
author_sort Mc Gee, Kevin
collection PubMed
description This paper was concerned with the current level of progress towards the development of chipless radio frequency identification (RFID) sensors that are capable of sensing strain and temperature. More specifically, it was interested in the possibility that the resulting devices could be used as a passive wireless structural health monitoring (SHM) sensor technology that could be printed in situ. This work contains the development and performance characterization results for both novel strain and novel temperature sensor designs with resulting sensitivities of 9.77 MHz/%ε and 0.88 MHz/°C, respectively. Furthermore, a detailed discussion on the interrogation system required to meet the relevant aerospace sensing requirements was also discussed, and several methods were explored to enhance the multi-sensor support capabilities of this technology.
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spelling pubmed-96955122022-11-26 Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring Mc Gee, Kevin Anandarajah, Prince Collins, David Sensors (Basel) Article This paper was concerned with the current level of progress towards the development of chipless radio frequency identification (RFID) sensors that are capable of sensing strain and temperature. More specifically, it was interested in the possibility that the resulting devices could be used as a passive wireless structural health monitoring (SHM) sensor technology that could be printed in situ. This work contains the development and performance characterization results for both novel strain and novel temperature sensor designs with resulting sensitivities of 9.77 MHz/%ε and 0.88 MHz/°C, respectively. Furthermore, a detailed discussion on the interrogation system required to meet the relevant aerospace sensing requirements was also discussed, and several methods were explored to enhance the multi-sensor support capabilities of this technology. MDPI 2022-11-10 /pmc/articles/PMC9695512/ /pubmed/36433277 http://dx.doi.org/10.3390/s22228681 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Mc Gee, Kevin
Anandarajah, Prince
Collins, David
Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring
title Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring
title_full Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring
title_fullStr Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring
title_full_unstemmed Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring
title_short Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring
title_sort use of chipless rfid as a passive, printable sensor technology for aerospace strain and temperature monitoring
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9695512/
https://www.ncbi.nlm.nih.gov/pubmed/36433277
http://dx.doi.org/10.3390/s22228681
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