A Numerical Investigation on Hydrothermal Performance of Micro Channel Heat Sink with Periodic Spatial Modification on Sidewalls

Electronic gadgets have been designed to incorporating very small components such as microcontrollers, electronic chips, transistors, microprocessors, etc. These components are exceptionally heat sensitive and can be wrecked if heat is not released. As a result, the thermal control of such component...

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Detalles Bibliográficos
Autores principales: Kumari, Nikita, Alam, Tabish, Ali, Masood Ashraf, Yadav, Anil Singh, Gupta, Naveen Kumar, Siddiqui, Md Irfanul Haque, Dobrotă, Dan, Rotaru, Ionela Magdalena, Sharma, Abhishek
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9696251/
https://www.ncbi.nlm.nih.gov/pubmed/36422415
http://dx.doi.org/10.3390/mi13111986

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9696251/
https://www.ncbi.nlm.nih.gov/pubmed/36422415
http://dx.doi.org/10.3390/mi13111986

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