Rational Design of Fluorinated Phthalonitrile/Hollow Glass Microsphere Composite with Low Dielectric Constant and Excellent Heat Resistance for Microelectronic Packaging

High-performance composites with a resin matrix are urgently required for electronic packaging due to their low dielectric constant, outstanding high temperature resistance, excellent corrosion resistance, light weight and easy molding. In this work, hollow-glass-microsphere (HGM)-filled fluorinated...

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Detalles Bibliográficos
Autores principales: Wu, Minjie, Han, Wenshuang, Zhang, Chun, Zhang, Shuo, Zhang, Xinyang, Chen, Xinggang, Naito, Kimiyoshi, Yu, Xiaoyan, Zhang, Qingxin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9698618/
https://www.ncbi.nlm.nih.gov/pubmed/36432259
http://dx.doi.org/10.3390/nano12223973

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