New Pressure-Sensitive Acrylic Adhesives for Low Energy Substrates Prepared via UV-Induced Telomerization with a Fluorine-Based Telogen

Novel pressure-sensitive adhesives (PSA) for low energy substrates were prepared by a solvent-free UV-initiated telomerization process using n-butyl acrylate, butyl methacrylate, and lauryl methacrylate (LMA), with trifluoroethanol (TFEtOH) as a telogen, and acylphosphine oxide (APO) as a radical photoinitiator. A crosslinking monomer (an aliphatic urethane acrylate, L9033) and a radical UV-photoinitiator (α-hydroxyalkylphenone) were also tested as components of the adhesive compositions. The influence of LMA and TFEtOH on the UV-phototelomerization process kinetics and the physicochemical features of the obtained fluorotelomers, as well as the concentration of L9033 on the PSA adhesion to a polyethylene surface, were investigated. FT-IR results indicated that the fluorine groups were successfully introduced into the telomer structure. The highest adhesion relative to a polyethylene substrate (12.3 N/25 mm), and the highest hydrophobicity (with a contact angle of 95° for a water/PSA system) were observed for adhesives based on a telomer syrup containing 5 wt. parts of TFEtOH and 30 wt. parts of LMA (per 100 wt. parts of the monomer mixture). Additionally, it was revealed that a higher aliphatic urethane acrylate content and a higher UV dose increased the adhesion feature.