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Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints

With the increasing use of underground cables, the quantity and quality of intermediate joints demanded are also increasing. The quality of the traditional crimping intermediate joint is easily affected by the actual process of the operator, which may lead to the heating of the crimping part of the...

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Autores principales: Zhang, Wenbin, Luo, Ruikang, Wu, Xuehua, Xu, Chungang, Suo, Chunguang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9737589/
https://www.ncbi.nlm.nih.gov/pubmed/36499882
http://dx.doi.org/10.3390/ma15238385
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author Zhang, Wenbin
Luo, Ruikang
Wu, Xuehua
Xu, Chungang
Suo, Chunguang
author_facet Zhang, Wenbin
Luo, Ruikang
Wu, Xuehua
Xu, Chungang
Suo, Chunguang
author_sort Zhang, Wenbin
collection PubMed
description With the increasing use of underground cables, the quantity and quality of intermediate joints demanded are also increasing. The quality of the traditional crimping intermediate joint is easily affected by the actual process of the operator, which may lead to the heating of the crimping part of the wire core, affecting the insulation performance of the cable, and finally causing the joint to break. However, aluminothermic reactive technology has some problems, such as a high welding temperature and an uncontrollable reaction. In order to solve these problems, according to the brazing principle and microalloying method, the optimal content of In in Sn-1.5Cu-based solder was explored, and then the connection of the middle joint of a 10 kV cable was completed using a connecting die and electrical connection process. The contact resistance and tensile strength of the joint were tested to verify the feasibility of this method. The results show that the maximum conductivity of the solder with 3.8% and 5% In content can reach 3.236 × 10(6) S/m, and the highest wettability is 93.6%. Finally, the minimum contact resistance of the intermediate joint is 7.05 μΩ, which is 43% lower than that of the aluminothermic welded joint, and the tensile strength is close to that of the welded joint, with a maximum of 7174 N.
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spelling pubmed-97375892022-12-11 Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints Zhang, Wenbin Luo, Ruikang Wu, Xuehua Xu, Chungang Suo, Chunguang Materials (Basel) Article With the increasing use of underground cables, the quantity and quality of intermediate joints demanded are also increasing. The quality of the traditional crimping intermediate joint is easily affected by the actual process of the operator, which may lead to the heating of the crimping part of the wire core, affecting the insulation performance of the cable, and finally causing the joint to break. However, aluminothermic reactive technology has some problems, such as a high welding temperature and an uncontrollable reaction. In order to solve these problems, according to the brazing principle and microalloying method, the optimal content of In in Sn-1.5Cu-based solder was explored, and then the connection of the middle joint of a 10 kV cable was completed using a connecting die and electrical connection process. The contact resistance and tensile strength of the joint were tested to verify the feasibility of this method. The results show that the maximum conductivity of the solder with 3.8% and 5% In content can reach 3.236 × 10(6) S/m, and the highest wettability is 93.6%. Finally, the minimum contact resistance of the intermediate joint is 7.05 μΩ, which is 43% lower than that of the aluminothermic welded joint, and the tensile strength is close to that of the welded joint, with a maximum of 7174 N. MDPI 2022-11-25 /pmc/articles/PMC9737589/ /pubmed/36499882 http://dx.doi.org/10.3390/ma15238385 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Zhang, Wenbin
Luo, Ruikang
Wu, Xuehua
Xu, Chungang
Suo, Chunguang
Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints
title Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints
title_full Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints
title_fullStr Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints
title_full_unstemmed Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints
title_short Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints
title_sort study on the application of modified sn-based solder in cable intermediate joints
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9737589/
https://www.ncbi.nlm.nih.gov/pubmed/36499882
http://dx.doi.org/10.3390/ma15238385
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