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Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints
With the increasing use of underground cables, the quantity and quality of intermediate joints demanded are also increasing. The quality of the traditional crimping intermediate joint is easily affected by the actual process of the operator, which may lead to the heating of the crimping part of the...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9737589/ https://www.ncbi.nlm.nih.gov/pubmed/36499882 http://dx.doi.org/10.3390/ma15238385 |
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author | Zhang, Wenbin Luo, Ruikang Wu, Xuehua Xu, Chungang Suo, Chunguang |
author_facet | Zhang, Wenbin Luo, Ruikang Wu, Xuehua Xu, Chungang Suo, Chunguang |
author_sort | Zhang, Wenbin |
collection | PubMed |
description | With the increasing use of underground cables, the quantity and quality of intermediate joints demanded are also increasing. The quality of the traditional crimping intermediate joint is easily affected by the actual process of the operator, which may lead to the heating of the crimping part of the wire core, affecting the insulation performance of the cable, and finally causing the joint to break. However, aluminothermic reactive technology has some problems, such as a high welding temperature and an uncontrollable reaction. In order to solve these problems, according to the brazing principle and microalloying method, the optimal content of In in Sn-1.5Cu-based solder was explored, and then the connection of the middle joint of a 10 kV cable was completed using a connecting die and electrical connection process. The contact resistance and tensile strength of the joint were tested to verify the feasibility of this method. The results show that the maximum conductivity of the solder with 3.8% and 5% In content can reach 3.236 × 10(6) S/m, and the highest wettability is 93.6%. Finally, the minimum contact resistance of the intermediate joint is 7.05 μΩ, which is 43% lower than that of the aluminothermic welded joint, and the tensile strength is close to that of the welded joint, with a maximum of 7174 N. |
format | Online Article Text |
id | pubmed-9737589 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-97375892022-12-11 Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints Zhang, Wenbin Luo, Ruikang Wu, Xuehua Xu, Chungang Suo, Chunguang Materials (Basel) Article With the increasing use of underground cables, the quantity and quality of intermediate joints demanded are also increasing. The quality of the traditional crimping intermediate joint is easily affected by the actual process of the operator, which may lead to the heating of the crimping part of the wire core, affecting the insulation performance of the cable, and finally causing the joint to break. However, aluminothermic reactive technology has some problems, such as a high welding temperature and an uncontrollable reaction. In order to solve these problems, according to the brazing principle and microalloying method, the optimal content of In in Sn-1.5Cu-based solder was explored, and then the connection of the middle joint of a 10 kV cable was completed using a connecting die and electrical connection process. The contact resistance and tensile strength of the joint were tested to verify the feasibility of this method. The results show that the maximum conductivity of the solder with 3.8% and 5% In content can reach 3.236 × 10(6) S/m, and the highest wettability is 93.6%. Finally, the minimum contact resistance of the intermediate joint is 7.05 μΩ, which is 43% lower than that of the aluminothermic welded joint, and the tensile strength is close to that of the welded joint, with a maximum of 7174 N. MDPI 2022-11-25 /pmc/articles/PMC9737589/ /pubmed/36499882 http://dx.doi.org/10.3390/ma15238385 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Zhang, Wenbin Luo, Ruikang Wu, Xuehua Xu, Chungang Suo, Chunguang Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints |
title | Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints |
title_full | Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints |
title_fullStr | Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints |
title_full_unstemmed | Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints |
title_short | Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints |
title_sort | study on the application of modified sn-based solder in cable intermediate joints |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9737589/ https://www.ncbi.nlm.nih.gov/pubmed/36499882 http://dx.doi.org/10.3390/ma15238385 |
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