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Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography

The mechanical properties of cured wood adhesive films were tested in a dry state by means of nanoindentation. These studies have found that the application of adhesives have an effect on the accuracy of the hardness and elastic modulus determination. The highest values of hardness among the tested...

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Autores principales: Bernaczyk, Arkadiusz, Wagenführ, André, Zboray, Robert, Flisch, Alexander, Lüthi, Thomas, Vetter, Birgit, Rentsch, Mario, Terfloth, Christian, Lincke, Jörg, Krystofiak, Tomasz, Niemz, Peter
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9739271/
https://www.ncbi.nlm.nih.gov/pubmed/36500102
http://dx.doi.org/10.3390/ma15238604
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author Bernaczyk, Arkadiusz
Wagenführ, André
Zboray, Robert
Flisch, Alexander
Lüthi, Thomas
Vetter, Birgit
Rentsch, Mario
Terfloth, Christian
Lincke, Jörg
Krystofiak, Tomasz
Niemz, Peter
author_facet Bernaczyk, Arkadiusz
Wagenführ, André
Zboray, Robert
Flisch, Alexander
Lüthi, Thomas
Vetter, Birgit
Rentsch, Mario
Terfloth, Christian
Lincke, Jörg
Krystofiak, Tomasz
Niemz, Peter
author_sort Bernaczyk, Arkadiusz
collection PubMed
description The mechanical properties of cured wood adhesive films were tested in a dry state by means of nanoindentation. These studies have found that the application of adhesives have an effect on the accuracy of the hardness and elastic modulus determination. The highest values of hardness among the tested adhesives at 20 °C have condensation resins: MF (0.64 GPa) and RPF (0.52 GPa). Then the decreasing EPI (0.43 GPa), PUR (0.23 GPa) and PVAc (0.14 GPa) adhesives. The values of the elastic modulus look a little bit different. The highest values among the tested adhesives at 20 °C have EPI (11.97 GPa), followed by MF (10.54 GPa), RPF (7.98 GPa), PVAc (4.71 GPa) and PUR (3.37 GPa). X-ray micro-computed tomography was used to evaluate the adhesive joint by the determination of the voids. It has been proven that this value depends on the type of adhesive, glue quantity and reactivity. The highest values of the void ratio achieve the PUR (17.26%) adhesives, then PVAc (13.97%), RRF (6.88%), MF (1.78%) and EPI (0.03%). The ratio of the gaps increases with the higher joint thickness. A too high proportion of voids may weaken the adhesive joint.
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spelling pubmed-97392712022-12-11 Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography Bernaczyk, Arkadiusz Wagenführ, André Zboray, Robert Flisch, Alexander Lüthi, Thomas Vetter, Birgit Rentsch, Mario Terfloth, Christian Lincke, Jörg Krystofiak, Tomasz Niemz, Peter Materials (Basel) Article The mechanical properties of cured wood adhesive films were tested in a dry state by means of nanoindentation. These studies have found that the application of adhesives have an effect on the accuracy of the hardness and elastic modulus determination. The highest values of hardness among the tested adhesives at 20 °C have condensation resins: MF (0.64 GPa) and RPF (0.52 GPa). Then the decreasing EPI (0.43 GPa), PUR (0.23 GPa) and PVAc (0.14 GPa) adhesives. The values of the elastic modulus look a little bit different. The highest values among the tested adhesives at 20 °C have EPI (11.97 GPa), followed by MF (10.54 GPa), RPF (7.98 GPa), PVAc (4.71 GPa) and PUR (3.37 GPa). X-ray micro-computed tomography was used to evaluate the adhesive joint by the determination of the voids. It has been proven that this value depends on the type of adhesive, glue quantity and reactivity. The highest values of the void ratio achieve the PUR (17.26%) adhesives, then PVAc (13.97%), RRF (6.88%), MF (1.78%) and EPI (0.03%). The ratio of the gaps increases with the higher joint thickness. A too high proportion of voids may weaken the adhesive joint. MDPI 2022-12-02 /pmc/articles/PMC9739271/ /pubmed/36500102 http://dx.doi.org/10.3390/ma15238604 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Bernaczyk, Arkadiusz
Wagenführ, André
Zboray, Robert
Flisch, Alexander
Lüthi, Thomas
Vetter, Birgit
Rentsch, Mario
Terfloth, Christian
Lincke, Jörg
Krystofiak, Tomasz
Niemz, Peter
Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography
title Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography
title_full Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography
title_fullStr Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography
title_full_unstemmed Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography
title_short Investigations on the Characterization of Various Adhesive Joints by Means of Nanoindentation and Computer Tomography
title_sort investigations on the characterization of various adhesive joints by means of nanoindentation and computer tomography
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9739271/
https://www.ncbi.nlm.nih.gov/pubmed/36500102
http://dx.doi.org/10.3390/ma15238604
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