Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

In this investigation, ultrasonic-assisted soldering at 260 °C in air produced high strength and high melting point Cu connections in 60 s using Ni foam reinforced Sn composite solder. Systematically examined were the microstructure, grain morphology, and shear strength of connections made with vari...

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Detalles Bibliográficos
Autores principales: He, Huang, Song, Lizhi, Gao, Haitao, Xiao, Yong, Cao, Yi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2022
Materias:
Sono-physico-chemical effect
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9763506/
https://www.ncbi.nlm.nih.gov/pubmed/36508893
http://dx.doi.org/10.1016/j.ultsonch.2022.106244

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9763506/
https://www.ncbi.nlm.nih.gov/pubmed/36508893
http://dx.doi.org/10.1016/j.ultsonch.2022.106244

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