Cargando…

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

In this investigation, ultrasonic-assisted soldering at 260 °C in air produced high strength and high melting point Cu connections in 60 s using Ni foam reinforced Sn composite solder. Systematically examined were the microstructure, grain morphology, and shear strength of connections made with vari...

Descripción completa

Detalles Bibliográficos
Autores principales:	He, Huang, Song, Lizhi, Gao, Haitao, Xiao, Yong, Cao, Yi
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Elsevier 2022
Materias:	Sono-physico-chemical effect
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9763506/ https://www.ncbi.nlm.nih.gov/pubmed/36508893 http://dx.doi.org/10.1016/j.ultsonch.2022.106244

Ejemplares similares

The influence of sulphide on the ultrasonic cavitation erosion-corrosion behaviors of HVOF-sprayed WC-Cr(3)C(2)-Ni coating
por: Shi, Xinlu, et al.
Publicado: (2023)

Theoretical prediction of the scattering of spherical bubble clusters under ultrasonic excitation
por: Xu, Xin, et al.
Publicado: (2023)

A comparison of the impacts of different polysaccharides on the sono-physico-chemical consequences of ultrasonic-assisted modifications
por: Chen, Jiahui, et al.
Publicado: (2023)

Evolution behavior of cavitation bubble in pure Sn liquid medium with narrow gap under low-amplitude ultrasound
por: Li, Guokui, et al.
Publicado: (2023)

Studies on ultrasound-mediated insertion-deletion polymorphisms of DNA and underlying mechanisms based on Ames tester strains
por: Li, Yunliang, et al.
Publicado: (2022)

Boosting the electrochemiluminescence of luminol by high-intensity focused ultrasound pretreatment combined with 1T/2H MoS(2) catalysis to construct a sensitive sensing platform
por: Du, Lin, et al.
Publicado: (2022)

Enhanced sonodynamic therapy by carbon dots-shelled microbubbles with focused ultrasound
por: Fan, Ching-Hsiang, et al.
Publicado: (2023)

Effect of ultrasound power on HCl leaching kinetics of impurity removal of aphanitic graphite
por: Bu, Xiangning, et al.
Publicado: (2023)

Improvement of Structural, Rheological, and physicochemical properties of type I collagen by calcium lactate combined with ultrasound
por: Zhang, Miao, et al.
Publicado: (2023)

Sonocrystallization of a novel ZIF/zeolite composite adsorbent with high chemical stability for removal of the pharmaceutical pollutant azithromycin from contaminated water
por: Liu, Zhiming, et al.
Publicado: (2023)

Effects of cavitation erosion-induced surface damage on the corrosion behaviour of TA31 Ti alloy
por: Li, Liang, et al.
Publicado: (2023)

Sonochemical synthesis of Ce-TiO(2) nanocatalyst and subsequent application for treatment of real textile industry effluent
por: Dey, Ananya, et al.
Publicado: (2023)

Sono-electrolysis performance based on indirect continuous sonication and membraneless alkaline electrolysis: Experiment, modelling and analysis
por: Kerboua, Kaouther, et al.
Publicado: (2023)

Evaluation of sono-physico-chemical and processing effects in the mixed sarcoplasmic protein/soy protein isolate system
por: Zhang, Miao, et al.
Publicado: (2023)

A comparative study on the influence of single and combined ultrasounds assisted flake graphite flotation
por: Zhou, Shaoqi, et al.
Publicado: (2023)

General analytical solution expressions for analyzing Langmuir-type kinetics of sonochemical degradation of nonvolatile organic contaminants in water
por: Hamdaoui, Oualid
Publicado: (2023)

A sonochemical synthesis of SrTiO(3) supported N-doped graphene oxide as a highly efficient electrocatalyst for electrochemical reduction of a chemotherapeutic drug
por: Rajaji, Umamaheswari, et al.
Publicado: (2023)

Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength
por: Atieh, Anas M., et al.
Publicado: (2019)

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints
por: Ren, Ning, et al.
Publicado: (2020)

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
por: Shen, Yu-An, et al.
Publicado: (2022)

Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention
por: Li, M. Y., et al.
Publicado: (2016)

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints
por: Hsu, Po-Ning, et al.
Publicado: (2022)

In situ synchrotron study of electromigration induced grain rotations in Sn solder joints
por: Shen, Hao, et al.
Publicado: (2016)

Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint
por: Lee, Sang-Yeob, et al.
Publicado: (2010)

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2021)

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum
por: Kolenak, Roman, et al.
Publicado: (2022)

The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration
por: Xu, Kexin, et al.
Publicado: (2021)

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder
por: Yamamoto, Mizuki, et al.
Publicado: (2021)

Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times
por: De Rose, Angela, et al.
Publicado: (2020)

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder
por: Yang, Wenchao, et al.
Publicado: (2023)

Soldering
por: Goslee, H. J.
Publicado: (1896)

Soldering
Publicado: (1897)

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties
por: Rajendran, Sri Harini, et al.
Publicado: (2021)

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder
por: Kolenak, Roman, et al.
Publicado: (2023)

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
por: Sun, Lingyao, et al.
Publicado: (2022)

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
por: Wang, Fengjiang, et al.
Publicado: (2017)

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints
por: Fu, Xing, et al.
Publicado: (2020)

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
por: Cui, Jianguo, et al.
Publicado: (2021)

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder
por: Yang, Fan, et al.
Publicado: (2017)

Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite
por: Zhang, Yubin, et al.
Publicado: (2020)

Cannot write session to /tmp/vufind_sessions/sess_jp9h62gkah3q5qp5kjdtrq9eos