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Effect and Mechanism of Solidified Microstructure on Deformation Behavior, Mechanical Properties, and Residual Stress of Cu-Ni-Si Alloy

Cu-Ni-Si alloy is the key raw material for the lead frame of large integrated circuits. The disordered grain orientation of alloy billet, high hardening rate, residual stress, and poor surface quality of cold working strips seriously affect its processability. In order to improve the cold-working pr...

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Detalles Bibliográficos
Autores principales:	Liao, Wanneng, Zhang, Chenxing, Qiang, Hui, Song, Weifei, Ren, Hongwen
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9781397/ https://www.ncbi.nlm.nih.gov/pubmed/36556532 http://dx.doi.org/10.3390/ma15248724

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