The Electrical and Thermal Characteristics of Stacked GaN MISHEMT

To study the working performance of 3D stacked chips, a double-layer stacked GaN MISHEMTs structure was designed to study the electro-thermal characteristics and heat transfer process of stacked chips. Firstly, the electrical characteristics of double-layer and single-layer GaN MISHEMTs are compared...

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Detalles Bibliográficos
Autores principales: Hui, Caixin, Chen, Qiuqi, Shi, Yijun, He, Zhiyuan, Huang, Yun, Lu, Xiangjun, Wang, Hongyue, Jiang, Jie, Lu, Guoguang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9786104/
https://www.ncbi.nlm.nih.gov/pubmed/36557400
http://dx.doi.org/10.3390/mi13122101

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9786104/
https://www.ncbi.nlm.nih.gov/pubmed/36557400
http://dx.doi.org/10.3390/mi13122101

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