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The Electrical and Thermal Characteristics of Stacked GaN MISHEMT

To study the working performance of 3D stacked chips, a double-layer stacked GaN MISHEMTs structure was designed to study the electro-thermal characteristics and heat transfer process of stacked chips. Firstly, the electrical characteristics of double-layer and single-layer GaN MISHEMTs are compared...

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Detalles Bibliográficos
Autores principales:	Hui, Caixin, Chen, Qiuqi, Shi, Yijun, He, Zhiyuan, Huang, Yun, Lu, Xiangjun, Wang, Hongyue, Jiang, Jie, Lu, Guoguang
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9786104/ https://www.ncbi.nlm.nih.gov/pubmed/36557400 http://dx.doi.org/10.3390/mi13122101

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