Thermal–Hydrodynamic Behavior and Design of a Microchannel Pin-Fin Hybrid Heat Sink

A three-dimensional convective heat transfer model of a microchannel pin-fin hybrid heat sink was established. Considering the non-uniform heat generation of 3D stacked chips, the splitting distance of pin-fins was optimized by minimizing the maximum heat sink temperature under different heat fluxes...

Descripción completa

Detalles Bibliográficos
Autores principales: Guan, Xiaonan, Xie, Zhihui, Nan, Gang, Xi, Kun, Lu, Zhuoqun, Ge, Yanlin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9787354/
https://www.ncbi.nlm.nih.gov/pubmed/36557435
http://dx.doi.org/10.3390/mi13122136

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9787354/
https://www.ncbi.nlm.nih.gov/pubmed/36557435
http://dx.doi.org/10.3390/mi13122136

Ejemplares similares