Flexible Polydimethylsiloxane Composite with Multi-Scale Conductive Network for Ultra-Strong Electromagnetic Interference Protection

HIGHLIGHTS: A multi-scale conductive network was constructed in flexible PDMS/Ag@PLASF/CNT composite with micro-size Ag@PLASF and nano-size CNT. The PDMS/Ag@PLASF/CNT composite showed outstanding electrical conductivity of 440 S m(-1) and superior electromagnetic interference shielding effectiveness of up to 113 dB. The PDMS/Ag@PLASF/CNT composites owned good retention (> 90%) of electromagnetic interference shielding performance even after subjected to a simulated aging strategy or 10,000 bending-releasing cycles. ABSTRACT: Highly conductive polymer composites (CPCs) with excellent mechanical flexibility are ideal materials for designing excellent electromagnetic interference (EMI) shielding materials, which can be used for the electromagnetic interference protection of flexible electronic devices. It is extremely urgent to fabricate ultra-strong EMI shielding CPCs with efficient conductive networks. In this paper, a novel silver-plated polylactide short fiber (Ag@PLASF, AAF) was fabricated and was integrated with carbon nanotubes (CNT) to construct a multi-scale conductive network in polydimethylsiloxane (PDMS) matrix. The multi-scale conductive network endowed the flexible PDMS/AAF/CNT composite with excellent electrical conductivity of 440 S m(−1) and ultra-strong EMI shielding effectiveness (EMI SE) of up to 113 dB, containing only 5.0 vol% of AAF and 3.0 vol% of CNT (11.1wt% conductive filler content). Due to its excellent flexibility, the composite still showed 94% and 90% retention rates of EMI SE even after subjected to a simulated aging strategy (60 °C for 7 days) and 10,000 bending-releasing cycles. This strategy provides an important guidance for designing excellent EMI shielding materials to protect the workspace, environment and sensitive circuits against radiation for flexible electronic devices. [Image: see text] SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s40820-022-00990-7.