The effects of complex agent and sintering temperature on conductive copper complex paste

In this research study, the formulation of precursor-type Cu pastes was done by mixing copper (II) acetate and 2-amino-2-methyl-1-propanol (AMP). Accordingly, the influence of the complex agent amount on the Cu pastes stability was examined at diverse mole ratio ratios. The Cu paste's optimal formulation was then obtained with the copper acetate to AMP ratio of 0.5. The Cu paste with a CuA/AMP ratio at 0.5 was then coated onto glass substrates; they were then sintered under an N(2) environment at various temperatures including 140, 180 and 220 °C. Characterization of the copper complex paste was done by Fourier transform infrared (FTIR) spectroscopy, UV–vis spectroscopy as well as Thermal analysis. Pattern's characterization was also done through X-ray diffractometry (XRD), field emission scanning electron microscope (FE-SEM) as well as four-point probe method for the purpose of confirming the related crystal structure, microstructure and electrical conductivity, respectively. It is demonstrated how the sintering temperature could affect the Cu film. The printed patterns on the glass substrate which was cured at the temperature of 180 °C displayed metalized cooper with low resistivity (30 μΩ cm) and dense copper films.