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Effects of Solvent Additive and Micro-Patterned Substrate on the Properties of Thin Films Based on P3HT:PC70BM Blends Deposited by MAPLE

Lately, there is a growing interest in organic photovoltaic (OPV) cells due to the organic materials’ properties and compatibility with various types of substrates. However, their efficiencies are low relative to the silicon ones; therefore, other ways (i.e., electrode micron/nanostructuring, synthe...

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Detalles Bibliográficos
Autores principales: Socol, Marcela, Preda, Nicoleta, Breazu, Carmen, Petre, Gabriela, Stanculescu, Anca, Stavarache, Ionel, Popescu-Pelin, Gianina, Stochioiu, Andrei, Socol, Gabriel, Iftimie, Sorina, Thanner, Christine, Rasoga, Oana
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9821753/
https://www.ncbi.nlm.nih.gov/pubmed/36614483
http://dx.doi.org/10.3390/ma16010144
Descripción
Sumario:Lately, there is a growing interest in organic photovoltaic (OPV) cells due to the organic materials’ properties and compatibility with various types of substrates. However, their efficiencies are low relative to the silicon ones; therefore, other ways (i.e., electrode micron/nanostructuring, synthesis of new organic materials, use of additives) to improve their performances are still being sought. In this context, we studied the behavior of the common organic bulk heterojunction (P3HT:PC70BM) deposited by matrix-assisted pulsed laser evaporation (MAPLE) with/without 0.3% of 1,8-diiodooctane (DIO) additive on flat and micro-patterned ITO substrates. The obtained results showed that in the MAPLE process, a small quantity of additive can modify the morphology of the organic films and decrease their roughness. Besides the use of the additive, the micro-patterning of the electrode leads to a greater increase in the absorption of the studied photovoltaic structures. The inferred values of the filling factors for the measured cells in ambient conditions range from 19% for the photovoltaic structures with no additive and without substrate patterning to 27% for the counterpart structures with patterning and a small quantity of additive.