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Thermal Transport in Extremely Confined Metallic Nanostructures: TET Characterization

In recent years, the continuous development of electronic chips and the increasing integration of devices have led to extensive research on the thermal properties of ultrathin metallic materials. In particular, accurate characterization of their thermal transport properties has become a research hot...

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Detalles Bibliográficos
Autores principales: Lin, Huan, Shen, Fuhua, Xu, Jinbo, Zhang, Lijun, Xu, Shen, Liu, Na, Luo, Siyi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9824337/
https://www.ncbi.nlm.nih.gov/pubmed/36616049
http://dx.doi.org/10.3390/nano13010140
Descripción
Sumario:In recent years, the continuous development of electronic chips and the increasing integration of devices have led to extensive research on the thermal properties of ultrathin metallic materials. In particular, accurate characterization of their thermal transport properties has become a research hotspot. In this paper, we review the characterization methods of metallic nanomaterials, focusing on the principles of the transient electrothermal (TET) technique and the differential TET technique. By using the differential TET technique, the thermal conductivity, electrical conductivity, and Lorenz number of extremely confined metallic nanostructures can be characterized with high measurement accuracy. At present, we are limited by the availability of existing coating machines that determine the thickness of the metal films, but this is not due to the measurement technology itself. If a material with a smaller diameter and lower thermal conductivity is used as the substrate, much thinner nanostructures can be characterized.