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Thermal Transport in Extremely Confined Metallic Nanostructures: TET Characterization

In recent years, the continuous development of electronic chips and the increasing integration of devices have led to extensive research on the thermal properties of ultrathin metallic materials. In particular, accurate characterization of their thermal transport properties has become a research hot...

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Detalles Bibliográficos
Autores principales: Lin, Huan, Shen, Fuhua, Xu, Jinbo, Zhang, Lijun, Xu, Shen, Liu, Na, Luo, Siyi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9824337/
https://www.ncbi.nlm.nih.gov/pubmed/36616049
http://dx.doi.org/10.3390/nano13010140

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