Surface modification and adhesive-free adhesion of polytetrafluoroethylene (PTFE) and silicone gel containing oleophilic SiO(2) powder by plasma treatment

Polytetrafluoroethylene (PTFE) has high-frequency characteristics and low transmission loss, and is expected to be used as a substrate material of printed wiring board for high-frequency applications. Meanwhile, silicone gel has superior properties such as attaching/detaching, weather resistance, and human safety. If the PTFE and silicone gel can be strongly adhered to, they can be applied to internet of things (IoT) devices that can be attached and detached freely. However, adhesion between PTFE, which has poor adhesion, and silicone gel, which has low mechanical strength, is difficult and has not been reported. In this study, PTFE was modified with heat-assisted plasma treatment, and silicone gel was treated with oleophilic SiO(2) powder to improve elastic modulus and modified with plasma jet treatment, and then bonded without adhesive. The adhesion strength of PTFE/silicone gel assembly was 1.13 N mm(−1) when treated moderately, but only 0.01 N mm(−1) when untreated and treated excessively. To investigate the factors causing the difference in the adhesion strength, the surface of silicone gel was evaluated by water contact angle measurement, Fourier transform infrared spectroscopy, and confocal laser scanning microscopy. When treated moderately, hydrophilic functional groups and cross-linking were most frequently increased. Furthermore, when treated excessively, surface degradation was observed, which was expected to lower the adhesion strength. The adhesive-free bonding between PTFE and silicone gel can open a new path for developing IoT devices that can be freely attached and detached.