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Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration
Electroplated Cu has been extensively applied in advanced electronic packaging, and its mechanical properties are critical for reliability. In this study, Cu foils fabricated through electroplating with various bis-(3-sulfopropyl) disulfide (SPS) concentrations are examined using tensile tests. The...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9829657/ https://www.ncbi.nlm.nih.gov/pubmed/36624120 http://dx.doi.org/10.1038/s41598-023-27669-2 |