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Electrochemically reduced graphene oxide (ERGO)-Cu bilayer structure fabricated at room temperature for future interconnects
Copper is an important interconnect material in integrated circuits (IC) due to its outstanding electrical and thermal properties. However, the development of the IC industry requires novel interconnect materials with higher conductivity. Here, uniform graphene oxide (GO) is deposited on copper by e...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
The Royal Society of Chemistry
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9841510/ https://www.ncbi.nlm.nih.gov/pubmed/36741139 http://dx.doi.org/10.1039/d2ra07223h |