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Enhancing the interfacial binding strength between modular stretchable electronic components

Stretchable electronics are emerging for personalized and decentralized clinics, wearable devices and human–machine interactions. Nowadays, separated stretchable functional parts have been well developed and are approaching practical usage. However, the production of whole stretchable devices with f...

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Detalles Bibliográficos
Autores principales: Ji, Shaobo, Chen, Xiaodong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Oxford University Press 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9843131/
https://www.ncbi.nlm.nih.gov/pubmed/36684519
http://dx.doi.org/10.1093/nsr/nwac172
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author Ji, Shaobo
Chen, Xiaodong
author_facet Ji, Shaobo
Chen, Xiaodong
author_sort Ji, Shaobo
collection PubMed
description Stretchable electronics are emerging for personalized and decentralized clinics, wearable devices and human–machine interactions. Nowadays, separated stretchable functional parts have been well developed and are approaching practical usage. However, the production of whole stretchable devices with full functions still faces a huge challenge: the integration of different components, which was hindered by the mechanical mismatch and stress/strain concentration at the connection interfaces. To avoid connection failure in stretchable devices, a new research focus is to improve the interfacial binding strength between different components. In this review, recent developments to enhance interfacial strength in wearable/implantable electronics are introduced and catalogued into three major strategies: (i) covalent bonding between different device parts, (ii) molecular interpenetration or mechanical interlocking at the interfaces and (iii) covalent connection between the human body and devices. Besides reviewing current methods, we also discuss the existing challenges and possible improvements for stretchable devices from the aspect of interfacial connections.
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spelling pubmed-98431312023-01-19 Enhancing the interfacial binding strength between modular stretchable electronic components Ji, Shaobo Chen, Xiaodong Natl Sci Rev Special Topic: Wearable Materials and Electronics Stretchable electronics are emerging for personalized and decentralized clinics, wearable devices and human–machine interactions. Nowadays, separated stretchable functional parts have been well developed and are approaching practical usage. However, the production of whole stretchable devices with full functions still faces a huge challenge: the integration of different components, which was hindered by the mechanical mismatch and stress/strain concentration at the connection interfaces. To avoid connection failure in stretchable devices, a new research focus is to improve the interfacial binding strength between different components. In this review, recent developments to enhance interfacial strength in wearable/implantable electronics are introduced and catalogued into three major strategies: (i) covalent bonding between different device parts, (ii) molecular interpenetration or mechanical interlocking at the interfaces and (iii) covalent connection between the human body and devices. Besides reviewing current methods, we also discuss the existing challenges and possible improvements for stretchable devices from the aspect of interfacial connections. Oxford University Press 2022-08-29 /pmc/articles/PMC9843131/ /pubmed/36684519 http://dx.doi.org/10.1093/nsr/nwac172 Text en © The Author(s) 2022. Published by Oxford University Press on behalf of China Science Publishing & Media Ltd. https://creativecommons.org/licenses/by/4.0/This is an Open Access article distributed under the terms of the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse, distribution, and reproduction in any medium, provided the original work is properly cited.
spellingShingle Special Topic: Wearable Materials and Electronics
Ji, Shaobo
Chen, Xiaodong
Enhancing the interfacial binding strength between modular stretchable electronic components
title Enhancing the interfacial binding strength between modular stretchable electronic components
title_full Enhancing the interfacial binding strength between modular stretchable electronic components
title_fullStr Enhancing the interfacial binding strength between modular stretchable electronic components
title_full_unstemmed Enhancing the interfacial binding strength between modular stretchable electronic components
title_short Enhancing the interfacial binding strength between modular stretchable electronic components
title_sort enhancing the interfacial binding strength between modular stretchable electronic components
topic Special Topic: Wearable Materials and Electronics
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9843131/
https://www.ncbi.nlm.nih.gov/pubmed/36684519
http://dx.doi.org/10.1093/nsr/nwac172
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