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Enhancing the interfacial binding strength between modular stretchable electronic components
Stretchable electronics are emerging for personalized and decentralized clinics, wearable devices and human–machine interactions. Nowadays, separated stretchable functional parts have been well developed and are approaching practical usage. However, the production of whole stretchable devices with f...
Autores principales: | , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Oxford University Press
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9843131/ https://www.ncbi.nlm.nih.gov/pubmed/36684519 http://dx.doi.org/10.1093/nsr/nwac172 |
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author | Ji, Shaobo Chen, Xiaodong |
author_facet | Ji, Shaobo Chen, Xiaodong |
author_sort | Ji, Shaobo |
collection | PubMed |
description | Stretchable electronics are emerging for personalized and decentralized clinics, wearable devices and human–machine interactions. Nowadays, separated stretchable functional parts have been well developed and are approaching practical usage. However, the production of whole stretchable devices with full functions still faces a huge challenge: the integration of different components, which was hindered by the mechanical mismatch and stress/strain concentration at the connection interfaces. To avoid connection failure in stretchable devices, a new research focus is to improve the interfacial binding strength between different components. In this review, recent developments to enhance interfacial strength in wearable/implantable electronics are introduced and catalogued into three major strategies: (i) covalent bonding between different device parts, (ii) molecular interpenetration or mechanical interlocking at the interfaces and (iii) covalent connection between the human body and devices. Besides reviewing current methods, we also discuss the existing challenges and possible improvements for stretchable devices from the aspect of interfacial connections. |
format | Online Article Text |
id | pubmed-9843131 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | Oxford University Press |
record_format | MEDLINE/PubMed |
spelling | pubmed-98431312023-01-19 Enhancing the interfacial binding strength between modular stretchable electronic components Ji, Shaobo Chen, Xiaodong Natl Sci Rev Special Topic: Wearable Materials and Electronics Stretchable electronics are emerging for personalized and decentralized clinics, wearable devices and human–machine interactions. Nowadays, separated stretchable functional parts have been well developed and are approaching practical usage. However, the production of whole stretchable devices with full functions still faces a huge challenge: the integration of different components, which was hindered by the mechanical mismatch and stress/strain concentration at the connection interfaces. To avoid connection failure in stretchable devices, a new research focus is to improve the interfacial binding strength between different components. In this review, recent developments to enhance interfacial strength in wearable/implantable electronics are introduced and catalogued into three major strategies: (i) covalent bonding between different device parts, (ii) molecular interpenetration or mechanical interlocking at the interfaces and (iii) covalent connection between the human body and devices. Besides reviewing current methods, we also discuss the existing challenges and possible improvements for stretchable devices from the aspect of interfacial connections. Oxford University Press 2022-08-29 /pmc/articles/PMC9843131/ /pubmed/36684519 http://dx.doi.org/10.1093/nsr/nwac172 Text en © The Author(s) 2022. Published by Oxford University Press on behalf of China Science Publishing & Media Ltd. https://creativecommons.org/licenses/by/4.0/This is an Open Access article distributed under the terms of the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse, distribution, and reproduction in any medium, provided the original work is properly cited. |
spellingShingle | Special Topic: Wearable Materials and Electronics Ji, Shaobo Chen, Xiaodong Enhancing the interfacial binding strength between modular stretchable electronic components |
title | Enhancing the interfacial binding strength between modular stretchable electronic components |
title_full | Enhancing the interfacial binding strength between modular stretchable electronic components |
title_fullStr | Enhancing the interfacial binding strength between modular stretchable electronic components |
title_full_unstemmed | Enhancing the interfacial binding strength between modular stretchable electronic components |
title_short | Enhancing the interfacial binding strength between modular stretchable electronic components |
title_sort | enhancing the interfacial binding strength between modular stretchable electronic components |
topic | Special Topic: Wearable Materials and Electronics |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9843131/ https://www.ncbi.nlm.nih.gov/pubmed/36684519 http://dx.doi.org/10.1093/nsr/nwac172 |
work_keys_str_mv | AT jishaobo enhancingtheinterfacialbindingstrengthbetweenmodularstretchableelectroniccomponents AT chenxiaodong enhancingtheinterfacialbindingstrengthbetweenmodularstretchableelectroniccomponents |