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Numerical Study on Effect of Contact and Interfacial Resistance on Thermal Conductivity of Dispersed Composites

A series of finite element analyses were conducted to clarify the effect of contact and interfacial resistance between constituents on effective thermal conductivities of dispersed composites. Equally dispersed fillers in FCC (face-centered cubic) and BCC (body-centered cubic) material systems were...

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Detalles Bibliográficos
Autores principales: Kondo, Atsushi, Matsuura, Hiroshi, Ito, Yoshiharu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9861606/
https://www.ncbi.nlm.nih.gov/pubmed/36676257
http://dx.doi.org/10.3390/ma16020517
Descripción
Sumario:A series of finite element analyses were conducted to clarify the effect of contact and interfacial resistance between constituents on effective thermal conductivities of dispersed composites. Equally dispersed fillers in FCC (face-centered cubic) and BCC (body-centered cubic) material systems were extracted from cyclic microstructures as unit cell models. In addition to spherical fillers, a polyhedron called the Wigner–Seitz cell that can realize a fully packed microstructure was chosen as the shape of the filler to investigate the effect of contact between the high volumetric fraction of fillers. The effective thermal conductivities of the resulting composites were calculated based on the FEA results and compared to the theoretical results for various volume fractions of the fillers including the maximum packing fraction. The following conclusions were obtained from the present study: 1. The effect of the contact depending on the shape and configuration of the fillers has more of a significant influence on the effective thermal conductivity than the influence of the increase in the volume fraction of the fillers. 2. When the contact occurred, the effective thermal conductivity became more than double that without contact. 3. Interfacial thermal resistance must be less than the order of 10(−4) m(2) K/W to obtain improvement in the effective thermal conductivity by compounding the fillers.