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Phase-Field Simulation of Temperature-Dependent Thermal Shock Fracture of Al(2)O(3)/ZrO(2) Multilayer Ceramics with Phase Transition Residual Stress

Compared with single-phase ceramics, the thermal shock crack propagation mechanism of multiphase layered ceramics is more complex. There is no experimental method and theoretical framework that can fully reveal the thermal shock damage mechanism of ceramic materials. Therefore, a multiphase phase-fi...

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Detalles Bibliográficos
Autores principales: Pang, Yong, Li, Dingyu, Li, Xin, Wang, Ruzhuan, Ao, Xiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9862266/
https://www.ncbi.nlm.nih.gov/pubmed/36676470
http://dx.doi.org/10.3390/ma16020734
Descripción
Sumario:Compared with single-phase ceramics, the thermal shock crack propagation mechanism of multiphase layered ceramics is more complex. There is no experimental method and theoretical framework that can fully reveal the thermal shock damage mechanism of ceramic materials. Therefore, a multiphase phase-field fracture model including the temperature dependence of material for thermal shock-induced fracture of multilayer ceramics is established. In this study, the effects of residual stress on the crack propagation of ATZ (Al(2)O(3)-5%tZrO(2))/AMZ (Al(2)O(3)-30%mZrO(2)) layered ceramics with different layer thickness ratios, layers, and initial temperatures under bending and thermal shock were investigated. Simulation results of the fracture phase field under four-point bending are in good agreement with the experimental results, and the crack propagation shows a step shape, which verifies the effectiveness of the proposed method. With constant thickness, high-strength compressive stress positively changes with the layer thickness ratio, which contributes to crack deflection. The cracks of the ceramic material under thermal shock have hierarchy and regularity. When the layer thickness ratio is constant, the compressive residual stress decreases with the increase in the layer number, and the degree of thermal shock crack deflection decreases.