A Study on the Control Method of 6-DOF Magnetic Levitation System Using Non-Contact Position Sensors

Recently, due to the development of semiconductor technology, high-performance memory and digital convergence technology that integrates and implements various functions into one semiconductor chip has been regarded as the next-generation core technology. In the semiconductor manufacturing process, various motors are being applied for automated processes and high product reliability. However, dust and shaft loss due to mechanical friction of a general motor system composed of motor-bearing are problematic for semiconductor wafer processing. In addition, in the edge bread remove (EBR) process after the photoresist application process, a nozzle position control system for removing unnecessary portions of the wafer edge is absolutely necessary. Therefore, in this paper, in order to solve the problems occurring in the semiconductor process, a six-degrees-of-freedom (6-DOF) magnetic levitation system without shaft and bearing was designed for application to the semiconductor process system; and an integrated driving control algorithm for 6-DOF control (levitation, rotation, tilt (Roll–Pitch), X–Y axis movement) using the force of each current component derived through current vector control was proposed. Finally, the 6-DOF magnetic levitation system with the non-contact position sensors was fabricated and the validity of the 6-DOF magnetic levitation control method proposed in this paper was verified through a performance test using a prototype.