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Editorial for the Special Issue on Advanced Interconnect and Packaging
| Autor principal: | |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9863365/ https://www.ncbi.nlm.nih.gov/pubmed/36677234 http://dx.doi.org/10.3390/mi14010171 |
| _version_ | 1784875316038074368 |
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| author | Zhao, Wen-Sheng |
| author_facet | Zhao, Wen-Sheng |
| author_sort | Zhao, Wen-Sheng |
| collection | PubMed |
| description | |
| format | Online Article Text |
| id | pubmed-9863365 |
| institution | National Center for Biotechnology Information |
| language | English |
| publishDate | 2023 |
| publisher | MDPI |
| record_format | MEDLINE/PubMed |
| spelling | pubmed-98633652023-01-22 Editorial for the Special Issue on Advanced Interconnect and Packaging Zhao, Wen-Sheng Micromachines (Basel) Editorial MDPI 2023-01-10 /pmc/articles/PMC9863365/ /pubmed/36677234 http://dx.doi.org/10.3390/mi14010171 Text en © 2023 by the author. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
| spellingShingle | Editorial Zhao, Wen-Sheng Editorial for the Special Issue on Advanced Interconnect and Packaging |
| title | Editorial for the Special Issue on Advanced Interconnect and Packaging |
| title_full | Editorial for the Special Issue on Advanced Interconnect and Packaging |
| title_fullStr | Editorial for the Special Issue on Advanced Interconnect and Packaging |
| title_full_unstemmed | Editorial for the Special Issue on Advanced Interconnect and Packaging |
| title_short | Editorial for the Special Issue on Advanced Interconnect and Packaging |
| title_sort | editorial for the special issue on advanced interconnect and packaging |
| topic | Editorial |
| url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9863365/ https://www.ncbi.nlm.nih.gov/pubmed/36677234 http://dx.doi.org/10.3390/mi14010171 |
| work_keys_str_mv | AT zhaowensheng editorialforthespecialissueonadvancedinterconnectandpackaging |