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Complex Impedance and Modulus Analysis on Porous and Non-Porous Scaffold Composites Due to Effect of Hydroxyapatite/Starch Proportion
This study aims to investigate the electric responses (complex modulus and complex impedance analysis) of hydroxyapatite/starch bone scaffold as a function of hydroxyapatite/starch proportion and the microstructural features. Hence, the non-porous and porous hydroxyapatite/starch composites were fab...
Autores principales: | , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9866754/ https://www.ncbi.nlm.nih.gov/pubmed/36679201 http://dx.doi.org/10.3390/polym15020320 |
Sumario: | This study aims to investigate the electric responses (complex modulus and complex impedance analysis) of hydroxyapatite/starch bone scaffold as a function of hydroxyapatite/starch proportion and the microstructural features. Hence, the non-porous and porous hydroxyapatite/starch composites were fabricated with various hydroxyapatite/starch proportions (70/30, 60/40, 50/50, 40/60, 30/70, 20/80, and 10/90 wt/wt%). Microstructural analysis of the porous hydroxyapatite/starch composites was carried out by using scanning electron microscopy. It shows that the formation of hierarchical porous microstructures with high porosity is more significant at a high starch proportion. The complex modulus and complex impedance analysis were conducted to investigate the electrical conduction mechanism of the hydroxyapatite/starch composites via dielectric spectroscopy within a frequency range from 5 MHz to 12 GHz. The electrical responses of the hydroxyapatite/starch composites are highly dependent on the frequency, material proportion, and microstructures. High starch proportion and highly porous hierarchical microstructures enhance the electrical responses of the hydroxyapatite/starch composite. The material proportion and microstructure features of the hydroxyapatite/starch composites can be indirectly reflected by the simulated electrical parameters of the equivalent electrical circuit models. |
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