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Influence of deposition temperature on microstructure and gas-barrier properties of Al(2)O(3) prepared by plasma-enhanced atomic layer deposition on a polycarbonate substrate

We prepared polymer-based encapsulation films by plasma-enhanced atomic layer deposition (PEALD) of Al(2)O(3) film on a polycarbonate (PC) substrate at 80–160 °C to fabricate Al(2)O(3)/PC barrier films. The thermal and dynamic mechanical properties of the PC substrate, the structural evolution of PE...

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Detalles Bibliográficos
Autores principales:	Ren, Yueqing, Sun, Xiaojie, Chen, Lanlan, Wei, Hui, Feng, Bo, Chen, Jingyun
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	The Royal Society of Chemistry 2023
Materias:	Chemistry
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9890669/ https://www.ncbi.nlm.nih.gov/pubmed/36756605 http://dx.doi.org/10.1039/d3ra00121k

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