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Manufacturing of Metal–Diamond Composites with High-Strength CoCrCu(x)FeNi High-Entropy Alloy Used as a Binder

This paper focuses on the study of the structure and mechanical properties of CoCrCu(x)FeNi high-entropy alloys and their adhesion to single diamond crystals. CoCrCu(x)FeNi alloys were manufactured by the powder metallurgy route, specifically via mechanical alloying of elemental powders, followed by...

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Detalles Bibliográficos
Autores principales: Loginov, Pavel A., Fedotov, Alexander D., Mukanov, Samat K., Manakova, Olga S., Zaitsev, Alexander A., Akhmetov, Amankeldy S., Rupasov, Sergey I., Levashov, Evgeny A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9919187/
https://www.ncbi.nlm.nih.gov/pubmed/36770289
http://dx.doi.org/10.3390/ma16031285
Descripción
Sumario:This paper focuses on the study of the structure and mechanical properties of CoCrCu(x)FeNi high-entropy alloys and their adhesion to single diamond crystals. CoCrCu(x)FeNi alloys were manufactured by the powder metallurgy route, specifically via mechanical alloying of elemental powders, followed by hot pressing. The addition of copper led to the formation of a dual-phase FCC + FCC2 structure. The CoCrCu(0.5)FeNi alloy exhibited the highest ultimate tensile strength (1080 MPa). Reductions in the ductility of the CoCrCu(x)FeNi HEAs and the tendency for brittle fracture behavior were observed at high copper concentrations. The equiatomic alloys CoCrFeNi and CoCrCuFeNi demonstrated high adhesion strength to single diamond crystals. The diamond surface at the fracture of the composites having the CoCrFeNi matrix had chromium-rich metal matrix regions, thus indicating that chromium carbide, responsible for adhesion, was formed at the composite–diamond interface. Copper-rich areas were detected on the diamond surface within the composites having the CoCrCuFeNi matrix due to the predominant precipitation of the FCC2 phase at the interfaces or the crack propagation along the FCC/FCC2 interface, resulting in the exposure of the Cu-rich FCC2 phase on the surface.