Protocol for high-throughput single-cell patterning using a reusable ultrathin metal microstencil

Exploiting convenient strategies for single-cell preparation while maintaining a high throughput remains challenging. This protocol describes a simple workflow for high-throughput single-cell patterning using a reusable ultrathin metal microstencil (UTmS). We describe UTmS-chip design, fabrication,...

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Detalles Bibliográficos
Autores principales: Tian, Qingqing, Xing, Kunming, Liu, Yongshu, Wang, Qian, Sun, Haonan, Sun, Ying-Nan, Zhang, Shusheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2023
Materias:
Protocol
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9947415/
https://www.ncbi.nlm.nih.gov/pubmed/36853712
http://dx.doi.org/10.1016/j.xpro.2023.102115

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