Push-Out Bond Strength of EndoSeal Mineral Trioxide Aggregate and AH Plus Sealers after Using Three Different Irrigation Protocols

Objective The current study was designed to assess the bonding strength of EndoSeal MTA and AH Plus sealers after using three irrigation protocols as follows: (1) 17% Ethylenediamine tetraacetic acid, (2) 7% maleic acid, and (3) 37% phosphoric acid. Materials and Methods Push-out bond strength was evaluated for 60 middle root slices of 1-mm thickness each. They were horizontally cut from freshly extracted single-rooted human teeth. A hole in the root canal was made using a carbide round bur of 1.1 mm in diameter in a middle third root slice. Specimens were dipped in 2.5% NaOCl, and then they were grouped into three groups; G1: 17% EDTA, G2: 7% maleic acid, and G3: 37% phosphoric acid as a final irrigant for 3 minutes. Each group was subdivided into two subgroups, according to the type of sealer, either EndoSeal MTA or AH Plus. Statistical Analysis After the full set of the sealer, the bond strength was evaluated with the push-out test by applying a force to each slice using a plunger with a 1-mm diameter. The one-way Tukey's post hoc test, analysis of variance (ANOVA) test, and Student's t -test were utilized to gather data and statistically evaluate it. Results The irrigation protocol used exhibited significant influence on the bond strength of EndoSeal MTA and AH Plus sealers. AH Plus sealer subgroups showed the highest bond strength with 7% maleic acid, followed by 37% phosphoric acid, and 17% EDTA. While in the EndoSeal MTA sealer subgroups, the highest bond strength was shown with the 17% EDTA followed by 7% maleic acid and 37% phosphoric acid, respectively. Conclusion The present study revealed that the type of the final irrigant significantly impacts the bond strength of the sealer used. The AH Plus sealer bond strength was improved by using the 7% maleic acid as a final irrigant. In contrast, the EndoSeal MTA sealer showed the best results with the 17% EDTA as a final irrigant.