Performance Study of Portable Semiconductor Refrigeration Device Based on CFD Simulation

Since the summer of 2022, the whole world has suffered the abnormal weather phenomena of high ambient temperature. Equipment for refrigeration, particularly portable refrigeration equipment, is crucial for personal protection in high–temperature environments, but cooling performance and miniaturization have been challenging issues. A portable air conditioner based on a semiconductor refrigeration device for human body cooling was developed. The total weight of the device is 450 g. The overall power consumption of the device is 82 W and the energy consumption ratio of semiconductor cooling plate is 0.85. The semiconductor refrigeration technology is based on the Peltier effect, supplemented by a DC fan to send the cooling air out to a specified position or zone. The structural parts are manufactured by 3D printing technology to make the overall size of the device more compact. The air volume and cooling performance of the device were analyzed by computational fluid dynamics simulation and the temperature distribution was measured by an infrared thermal imager and other instruments, and the measured results agreed with the CFD simulation results. The test ambient temperature was 20 °C. The measurement results showed that the wind speed of the hot air outlet was 6.92 m/s and that of the cold air outlet was 8.24 m/s. The cold air surface temperature reached a stable state of 13.9 °C in about 4 min, while the hot air surface temperature reached a stable state of 47.2 °C.